IC Component Owner
Job Description
Company: Hero MotoCorp Ltd.
Location: Jaipur, Rajasthan, India
Job Type: Full-Time
Experience: 3 – 5 Years
Education: B. Tech / M. Tech in Electronics (Advanced qualifications are an advantage)
Expected Salary: ₹8 – ₹12 Lakhs per year (plus employer benefits)
Job Category: Engineering, Automotive Jobs
Website: Website info
Contact: Contact us
About the Role:
As an IC Component Owner at Hero MotoCorp Ltd., you will take the lead in designing,
developing, and modifying electronic module hardware for critical vehicle electronic (VE)
components.
Your responsibilities include designing fault-free modules by employing best practices
aligned with the latest automotive safety standards. You will work closely with hardware
architects, firmware, integration, and testing teams to meet vehicle project targets while
directly focusing on VE critical parts such as Instrument Clusters, BCMs, Vehicle
Sensors, Immobilisers, Navigation Devices, and Infotainment systems.
Additionally, you must be able to provide Statement of Requirements (SOR) and Software
Requirements Documents (SRD) for specific parts and have a working knowledge of
mobile applications.
About Hero MotoCorp:
Headquartered in New Delhi, Hero MotoCorp is the world’s largest manufacturer of
motorcycles and scooters, recognized for its quality, innovative mobility solutions, and
eco-friendly technologies.
With a presence in 47 countries across Asia, Africa, Latin America, and the Middle East,
we have achieved the milestone of 110 million cumulative production and sales.
Our state-of-the-art R&D ecosystem spans across India and Germany, supporting our
vision “Be the Future of Mobility” and our ambition to achieve the next 100 million sales
by 2030. We are also a global leader in sustainability and corporate excellence, with
extensive involvement in sports and cultural initiatives.
A Day in the Life:
→ Hardware Design & Development:
o Design and develop hardware for VE system components, including logic
boards, analog boards, and power boards.
o Utilize development tools (e.g., Spice, Orcad) and simulation software
(e.g., Ansys, Altair) for thermal and vibration analysis.
→ Technical Evaluation & Collaboration:
o Interact continuously with HW architects, firmware, integration, and
testing teams to ensure that designs meet project targets and quality
standards.
o Provide SOR and SRD for specific components.
→ Failure Analysis & Problem Solving:
o Identify failure modes in electronic modules and propose effective
mitigation strategies.
o Prepare design records and testing data to document and support
improvements.
→ Mobile & UI Knowledge:
o Leverage knowledge of mobile applications and TFT UI/UX to contribute to
integrated system development.
→ Optional PCB Development:
o Although not mandatory, PCB Gerber development is a plus.
Technical Skills / Knowledge:
→ Hardware Design:
o Proficiency in hardware design using tools such as Spice and Orcad.
o Experience with simulation tools for thermal and electrical analysis (e.g.,
Ansys, Altair, Opera, JMag) is a plus.
→ System-Level Understanding:
o Ability to finalize specifications and test methodologies based on system
requirements.
o Knowledge of IPC standards, customer voice, and software requirements
in hardware integration.
→ Automotive Standards:
o Understanding of EMC effects and analysis; familiarity with automotive
standards including ISO 26262, AEC Q100, and EMI/ESD requirements.
→ Communication Protocols:
o Knowledge of I2C, SPI, CAN, LIN.
→ Mobile & UI/UX:
o Basic understanding of mobile app integration, TFT UI/UX, and Unified
Diagnostic Services (UDS) is required.
→ Behavioural Skills:
o Adaptability and self-motivation
o Innovative thinking and capability to leverage new technologies
o Strong sense of achievement and ownership
o Openness to new approaches and high flexibility
